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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
20 November 2024
NuLink PHY on Samsung’s SF4X process node
Eliyan tapes out NuLink PHY on Samsung’s SF4X process node Eliyan has announced the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module on Samsung Foundry’s SF4X 4nm For full article
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19 November 2024
Global Semiconductor Alliance 2024 Award Nominees
The Global Semiconductor Alliance (GSA) is pleased to announce its 2024 award nominees. For full article
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14 November 2024
Breaking Boundaries
Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024 On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan For full article
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15 October 2024
Up to 10 times the performance for AI?
Up to 10 times the performance for AI? Developing a unique technology for chiplet interconnection Eliyan In the semiconductor industry, the "chiplet method" that integrates multiple functional dies is attracting attention For full article
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14 October 2024
UMI: Extending Chiplet Interconnect Standards
UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect. For full article
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