Chiplets and Packaging Intertwine - Wired Island

Client Results >

Eliyan

Chiplets and Packaging Intertwine

September 26, 2023

How the Worlds of Chiplets and Packaging Intertwine

Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking.

For full article

Search

< PREVIOUS RESULT

Client Highlights

Ceres Holographics

Next generation transparent display technology

Innovations in heads up displays (HUDs)

Eliyan

Multi-die chip technology

Enabling the chiplet era for high performance computing

Intrinsic ID

PUF-based security for IoT

Securing our digital lives with better authentication

Prophesee

Neuromorphic-enabled vision sensors

Changing the paradigm in how machines can see

SandBox Semiconductor

Semiconductor Manufacturing Technology

Leveraging AI to improve the chip making process

Synaptics

Sensors and connectivity for next gen electronics

Engineering exceptional experiences in IoT

MORE CLIENT RESULTS >

Every company wants to be in the spotlight.

We deliver customized PR and communications programs that are intended to inspire our clients’ most important audiences. That audience may be you.

Public Relations and Communications Strategy for Technology Companies

Charleston, USA - Paris, France

Copyright ©2024 | Wired Island PR. All Rights Reserved