Clients >

Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
14 October 2024
UMI: Extending Chiplet Interconnect Standards
UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect. For full article
Read More >
09 October 2024
Eliyan chiplet interconnect fabbed on 3nm process
Eliyan, the chiplet interconnect specialist, has got first silicon of its NuLink-2.0 PHY, manufactured on a 3nm process. For full article
Read More >
09 October 2024
Eliyan delivers 3nm chiplet interconnect
Startup Eliyan has shipped first silicon of the industry’s highest performing chiplet interconnect. For full article
Read More >
26 September 2024
Gen AI is hitting limits
Gen AI is hitting limits but these new chipmakers can help At times, the development of generative AI has seemed unstoppable. Products like ChatGPT have become a fixture of everyday life For full article
Read More >
29 August 2024
A Breakthrough Alternative For Multi-Die Assemblies
Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies For full article
Read More >
Union
Improve Visibilty.
From Silicon Valley to tech centers in Europe and Israel to the far reaches of Asia, our clients all share a common goal - to reach technically-savvy audiences. We are delighted to be thier partner.
ABOUT WIRED ISLAND
WiredIsland Logo
Public Relations and Communications Strategy for Technology Companies
Charleston, USA - Paris, France

Copyright ©2024 | Wired Island PR. All Rights Reserved

Privacy Policy