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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
27 March 2024
Samsung and Tiger Global Back Eliyan
Samsung and Tiger Global Back Silicon Valley Chip Startup Eliyan AI chip tech provider Eliyan Corp. raised $60 million in a Series B funding round co-led by Samsung Catalyst Fund and Tiger Global Management. For full article
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25 March 2024
Eliyan now backed by all major memory firms
Chiplet interconnect startup Eliyan Corp has raised US$60 million in a Series B funding round led by Samsung Catalyst Fund and Tiger Global Management. For full article
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25 March 2024
Eliyan raises $60M
Eliyan raises $60M for chiplet interconnects that speed up AI chips Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. For full article
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27 February 2024
SEMICON Korea 2024 Takeaways
Memory devices must combine new levels of capacity and power efficiency with higher performance to process the vast amounts of data For full article
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08 February 2024
Chiplet Mission
Chiplet Mission: Navigate Interconnect Complexity Chiplets present a set of multi-layered, multi-faceted, multi-dimensional technology and business problems with no one-size-fits-all answer. For full article
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