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Eliyan

Next gen semiconductor technology
Enabling the next generation of semiconductor technology in high performance chiplets

Eliyan is a start up that is developing a breakthrough approach to implementing chiplets, a fast growing and necessary trend in helping Moore’s Law keep pace in achieving higher levels of performance, cost effectiveness and system-level integration in leading edge semiconductors. Through Eliyan’s unique interconnect technology, dubbed NuLink, it can achieve a significant advancement over traditional packaging methods (e.g. silicon interposers) for chiplet-based SIP in terms of speed, bandwidth, size, power.

Coming out of stealth-mode, Elyian approached Wired Island to help launch the company to the public and ensure its position as a leader in this quickly crowding landscape. Our campaign launched with a focus on news announcements including their Series A funding. We have continued to support the business with media relations and keeping a pulse on industry trends for which their founders can comment on.

Key Coverage
07 February 2024
Eliyan Sets New Standard for Chiplet Interconnect
Eliyan Corporation has announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures. For full article
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05 February 2024
Eliyan Breaks Chiplet Memory Wall
Eliyan Breaks Chiplet Memory Wall With Standard Packaging Eliyan recently taped out its NuLink die-to-die PHY IP on TSMC N3, achieving 64 Gbps per bump using standard packaging,  For full article
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02 February 2024
Three anecdotes recount design progress
The chiplet design movement representing multi-billion-dollar market potential is marching ahead with key building blocks falling in place For full article
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01 February 2024
Chiplets and the early adopter's dilemma
Early adopters in the chiplet arena face a dilemma For full article
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24 October 2023
Chiplets and Packaging Intertwine
How the Worlds of Chiplets and Packaging Intertwine Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. For full article
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