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Eliyan Sets New Standard for Chiplet Interconnect

Eliyan Corporation has announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures. For full article

Ceres Holographics

Transparent Displays Come Into Focus

Autonomous driving tech took a backseat this year at CES 2024, with cockpit user experience seen as a key differentiator among brands, especially in the EV era. For full article

Ceva

CEO Panush Writes Ceva's Next Growth Chapter

Ceva CEO Amir Panush has his work cut out for him. The DSP powerhouse’s growth was built on the industry’s standards-based high-quality IP. For full article

Eliyan

Eliyan Breaks Chiplet Memory Wall

Eliyan Breaks Chiplet Memory Wall With Standard Packaging Eliyan recently taped out its NuLink die-to-die PHY IP on TSMC N3, achieving 64 Gbps per bump using standard packaging, For full article

Riverlane

2024: The year quantum moves past its hype?

Viewers of the popular 60 Minutes television magazine may have been surprised to see a feature in December on the state of quantum computing For full article

Prophesee

Zinn Labs Announces AI-Enabled Smart Frames

Zinn Labs Announces Event-Based Gaze-Tracking System for AI-Enabled Smart Frames and VR/MR Systems Zinn Labs is introducing the industry’s first event-based gaze-tracking system for VR/MR headsets and smart frames. For full article

Eliyan

Three anecdotes recount design progress

The chiplet design movement representing multi-billion-dollar market potential is marching ahead with key building blocks falling in place For full article

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