High bandwidth memory (HBM) is becoming more mainstream. With the latest iteration’s specifications approved, vendors in the ecosystem are gearing to make sure it can be implemented so customers can begin to design, test and deploy systems.

The massive growth and diversity in artificial intelligence (AI) means HBM is less than niche. It’s even become less expensive, but it’s still a premium memory and requires expertise to implement. As a memory interface for 3D-stacked DRAM, HBM achieves higher bandwidth while using less power in a form factor that’s significantly smaller than DDR4 or GDDR5 by stacking as many as eight DRAM dies with an optional base die which can include buffer circuitry and test logic.

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