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BoW Strengthens Pathway

January 26, 2023

BoW Strengthens Pathway to Chiplet Standardization

This week’s Chiplet Summit underscores the rapid evolution of the ecosystem around multi-die chip design.

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Client Highlights

Ceres Holographics

Next generation transparent display technology

Innovations in heads up displays (HUDs)

Eliyan

Multi-die chip technology

Enabling the chiplet era for high performance computing

Intrinsic ID

PUF-based security for IoT

Securing our digital lives with better authentication

Prophesee

Neuromorphic-enabled vision sensors

Changing the paradigm in how machines can see

SandBox Semiconductor

Semiconductor Manufacturing Technology

Leveraging AI to improve the chip making process

Synaptics

Sensors and connectivity for next gen electronics

Engineering exceptional experiences in IoT

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