Manufacturing Bits: Oct. 22

Prophesee

October 26, 2021

In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages.

Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB technology.

For full article

< PREVIOUS RESULT

NEXT RESULT >

Client Highlights

Every company wants to be in the spotlight.

We deliver customized PR and communications programs that are intended to inspire our clients’ most important audiences. That audience may be you.

OUR SERVICES

Public Relations and Communications Strategy for Technology Companies

Charleston, USA - Paris, France

Prophesee

Client Highlights

Ceres Holographics

Eliyan

Intrinsic ID

Prophesee

SandBox Semiconductor

Synaptics