Panel Tackles Chiplet Packaging Challenges - Wired Island

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Panel Tackles Chiplet Packaging Challenges

March 16, 2023

QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California.

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Client Highlights

Ceres Holographics

Next generation transparent display technology

Innovations in heads up displays (HUDs)

Eliyan

Multi-die chip technology

Enabling the chiplet era for high performance computing

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PUF-based security for IoT

Securing our digital lives with better authentication

Prophesee

Neuromorphic-enabled vision sensors

Changing the paradigm in how machines can see

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Semiconductor Manufacturing Technology

Leveraging AI to improve the chip making process

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Sensors and connectivity for next gen electronics

Engineering exceptional experiences in IoT

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